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  •  10/16/2018

USI Developed the World’s First SiPSet Notebook Motherboard in the Size of Credit Card

(2018-10-16, Shanghai) USI (SSE: 601231), a giant electronics designer and manufacturer in the world, has developed a series of System-in-Package Set (SiPset) modularized products using its Miniaturization Technology, such as Thunderbolt SiPSet, Audio SiPSet and PMIC SiPSet, to help system product R&D personnel integrate more functions into motherboards of existing size, or reduce the size of existing motherboards without sacrificing any function. USI’s SiPSet modularized products can not only improve the freedom of product design, but also maximize the creativity of product designers to create the most competitive products.

Based on years of experience in design and verification of system function modules and advanced semiconductor packaging processes, by integrating multiple functional circuit modules, USI has developed SiPSet modularized products which can be applied to various computing products. According to the Q4 report given by Gartner in 2017, high-end Ultraslim notebook (Ultraslim NB) has a compound growth rate of 15.43% in the relatively mature personal computer market, and has become a new blue ocean of this industry. USI’s SiPSet modularized products can help customers develop light & thin and multifunctional products in terms of high-end Ultraslim NB.

With more than 20 years of experience in x86 platform design, the Company’s R&D team can modularize circuits with specific functions (e.g., power control circuit, audio circuit, and I/O interface circuit, etc.), and introduce optimized design into the Miniaturization Technology to complete SiPSet modularized products. There are two advantages of introduction of modularized SiPSet: a. it can reduce the time and manpower input by customers in the development of the same generation of platform; b. it can largely reduce the area and complexity of circuits, which can reduce the size of motherboard and make motherboard design simpler.

NB-SKL-01 is a notebook motherboard independently developed by USI using Intel SkyLake-Y, in which the main control ICs such as Power Management, Audio Codec, charging control and embedded control circuits as well as peripheral components are designed as SiPSets modularized product using the Miniaturization Technology by adopting such packaging processes as HD-SMT and Conformal Shielding. The NB-SKL-01 motherboard reduces the size of platform motherboard to the size of a credit card, and significantly improves the efficiency in electromagnetic interface shielding.


About USI (SSE: 601231)
USI is a leading global D(MS)2 company providing design, miniaturization, material sourcing, manufacturing, logistics, and after services of electronic devices/modules for brand owners. USI is a member of ASE Group and has been listed in Shanghai Stock Exchange in 2012. It has many years of experience in the electronics manufacturing services industry and leverages the industry-leading technology of ASE Group, which enables USI to offer customers diversified products in the sectors of wireless communication, computer and storage, consumer, industrial, and automotive electronics worldwide. Through the sales service network in North America, Europe, Japan, Mainland China, Taiwan, and manufacturing sites in Mainland China, Taiwan and Mexico. USI has about 17,000 people worldwide. For more information, please visit the website www.usish.com.
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